Predictions World
Touching An Intelligent World
5G, cloud, IoT, AI...these and other quickly converging technologies are creating a world in which everything is connected, sensing, and intelligent. And that world is arriving fast. HT@2025 charts 10 industry trends that we believe will shape a better future for everyone , everywhere.
Augmented Creativity By 2025, 97% of large companies will be using AI in their services or operations.
5G's Rapid Rollout By 2025, 5G networks will cover 58% of the world’s population.
Smart Home Solutions
- 3D Gesture Control, Touchless Control Lights， Integrated short-distance detection technology, you can now have fun with 3D Light Music. Move your hand sideways over the top to turn the light off and back on. Even cooler, you can control the brightness by moving your hand up and down over the light.Bluetooth/360° 、8W Speaker / wifi /
- Intelligent properties: Mobile APP control, compatible with Alexa, google home and IFTTT voice control, RGBW color control, timing control.
"Multiple Chips & Cups on Board" light source design
LED light bulbs using a "Multiple Chips & Cups on Board" light source design.
Unique heat dissipation technology achieves the industrys most high energy efficient LED lamps.
In the current lighting in the area for all occasions, the color has been more attention. Indoor environment, higher color rendering requirements. Such as the MCOB LED Lighting 100-130 lm / W luminous efficiency, color rendering index of 95.
AI Robot
- Features:
- Metal structure,stable and durable:the chassis,driving wheel and load bearing wheel use aluminium alloy.
- Reserve many install interface:Arduino UNO R3;NodeMCU WiFi developing module;9g servo reserved install port;standard servo reserved hole;mechanical arm reserved hole.
- It uses large GM-25-370 DC motor ,high quality Hall sensor (code disc)
- Separate shock absorption system,many bearing design.The shock absorption joint uses bearings (8 position in total)
Product Description
- Control Way: The WiFi control unit provides flexible control of the movement, grabbing of the robot arm. The 7-axis robotic arm is made of all metal for extra durability.
- Tank Chassis:Aluminum alloy tank chassis is with sandblasted oxidation treatment. With reserved holes for controller in the chassis, it is easy to install development boards. The stable tank can move forward, backward, turn left and right freely.
- Robotic Arm:It can move forward, backward, turn left and right, gripping items within the range of 200mm.
3D Hologram Solutions
What is a 3D Hologram Fan(Advertising Machine)
- Recently, the more dazzling 3D holographic products, fans can be held in hand to play the three-dimensional picture, some people call it the so-called "black technology", in fact, it is called the three-dimensional holographic fan（advertising machine).
- The image presented by the 3D holographic advertisement machine is combined with fan rotation + LED lamp display, using the principle of human eye temporary, to form the aerial illusion of graphics, animation and video.
- Using the parallax characteristic of human eyes, it can obtain realistic stereo images with space and depth without any auxiliary equipment (such as 3D glasses, helmet, etc.). The things in the picture can be protruded out of the picture or hidden in the picture. Brilliant colors, distinct layers, vivid and vivid are the real 3D floating images.
- The persistent factor of human vision (POV technology) is to rotate the image by densely aligning one or more rows of LEDs.
- Based on the principle of human visual persistence, the core electronics technology has developed this shape resembling electric fan. By uploading the 3D stereo content after modeling, the complete 3D stereo picture can be clearly presented.
3D mcob LED packaging technology
- Combining the advantages of 3D and 2D stacking, HT Lighting ODI omnidirectional interconnection technology can be realized by wiring gaps between multiple small chips.
- The principle of 3D packaging is to make a transistor (CMOS) structure on the chip, and directly use silicon perforations to connect the electronic signals of different chips, so as to stack the memory or other chips vertically.